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datashee t product structure : silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays 1/36 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 16.feb.2016 rev.002 tsz02201-0r1r0g100210-1-2 www.rohm.com serial eeprom series automotive eeprom 125c operation spi bus eeprom br25h640-2ac general description br25h640-2ac is a 64kbit serial eep rom of spi bus interface method. features packages w(typ) x d(typ) x h(max) spi bus interface (cpol, cpha)=(0,0), (1,1) voltage range : 2.5v to 5.5v operating range : -40c to +125c clock frequency : 10mhz(max) write time : 4ms(max) page size : 32bytes bit format : 8192 x 8bit 32bytes write lockable identification page (id page) address auto increment function at read operation auto erase and auto end function at data rewrite write protect block setting by software memory array 1/4, 1/2, whole hold function by holdb pin low supply current write operation (5v) : 1.0ma (typ) read operation (5v) : 1.2ma (typ) standby state(5v) : 0.1 a (typ) prevention of write mistake write prohibition at power on write prohibition by wpb pin write prohibition block setting prevention of write mistake at low voltage write cycles : 1,000,000 write cycles (ta 85c) : 500,000 write cycles (ta 105c) : 300,000 write cycles (ta 125c) data retention : 100 years (ta 25c) : 60 years (ta 105c) : 50 years (ta 125c) data at shipment memory array ffh id page first 3 addresses 2fh, 00h, 0dh other addresses ffh status register wpen, bp1, bp0 0, 0, 0 lock status ls 0 msop8, tssop-b8, sop8, sop-j8 packages aec-q100 qualified tssop-b8 3.00mm x 6.40mm x 1.20mm sop8 5.00mm x 6.20mm x 1.71mm sop-j8 4.90mm x 6.00mm x 1.65mm msop8 2.90mm x 4.00mm x 0.90mm downloaded from: http:///
br25h640-2ac 2/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 absolute maximum ratings (ta=25c) parameter symbol rating unit supply voltage vcc -0.3 to +6.5 v power dissipation pd 0.38 (msop8) (note1) w 0.41 (tssop-b8) (note2) 0.56 (sop8) (note3) 0.56 (sop-j8) (note4) storage temperature range tstg -65 to +150 c operating temperature rang e topr -40 to +125 c terminal voltage -0.3 to +6.5 v maximum junction temperature tjmax 150 c electrostatic discharge voltage (human body model) v esd -6000 to +6000 v (note1) derate by 3.1mw/c when operating above ta=25c (note2) derate by 3.3mw/c when operating above ta=25c. (note3) derate by 4.5mw/c when operating above ta=25c. (note4) derate by 4.5mw/c when operating above ta=25c. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. ther efore, it is important to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. memory cell characteristics (vcc=2.5v to 5.5v) parameter limit unit condition min typ max write cycles (note5, 6) 1,000,000 cycles ta 85c 500,000 cycles ta 105c 300,000 cycles ta 125c data retention (note5) 100 years ta 25c 60 years ta 105c 50 years ta 125c (note5) not 100% tested (note6) the write cycles is defined for unit of 4 data bytes with the same address bits of a12 to a2. recommended operating ratings parameter symbol rating unit min max supply voltage vcc 2.5 5.5 v input voltage v in 0 vcc v bypass capacitor c 0.1 f input / output capacitance (ta=25c, frequency=5mhz) parameter symbol cond itions min max unit input capacitance (note7) c in v in =gnd 8 pf output capacitance (note7) c out v out =gnd 8 pf (note7) not 100% tested downloaded from: http:///
br25h640-2ac 3/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 dc characteristics (unless otherwise specified, ta=-40c to +125c, vcc=2.5v to 5.5v) parameter symbol limit unit conditions min typ max input high voltage v ih 0.7 vcc vcc+0.3 v 2.5v vcc 5.5v input low voltage v il -0.3 0.3 vcc v 2.5v vcc 5.5v output low voltage v ol 0 0.4 v i ol =2.1ma output high voltage v oh 0.8 vcc vcc v i oh =-2.0ma input leakage current i li -2 +2 a v in =0v to vcc output leakage current i lo -2 +2 a v out =0v to vcc, csb=vcc supply current (write) i cc1 2.5 ma vcc=2.5v, f sck =5mhz, t e/w =4ms v ih /v il =0.9vcc/0.1vcc, so=open i cc2 5.5 ma vcc=5.5v, f sck =5 or 10 mhz, t e/w =4ms v ih /v il =0.9vcc/0.1vcc, so=open supply current (read) i cc3 1.5 ma vcc=2.5v, f sck =5mhz v ih /v il =0.9vcc/0.1vcc, so=open i cc4 2.0 ma vcc=5.5v, f sck =5mhz v ih /v il =0.9vcc/0.1vcc, so=open i cc5 4.0 ma vcc=5.5v, f sck =10mhz v ih /v il =0.9vcc/0.1vcc, so=open standby current i sb 10 a vcc=5.5v csb=holdb=wpb=vcc, sck=si=vcc or 0v, so=open downloaded from: http:///
br25h640-2ac 4/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 ac characteristics (ta=-40c to +125c, unless otherwise specified, load capacitance c l1 =100pf) parameter symbol 2.5v vcc 5.5v 4.5v vcc 5.5v unit min typ max min typ max sck frequency f sck 0.01 5 0.01 10 mhz sck high time t sckwh 85 40 ns sck low time t sckwl 85 40 ns csb high time t cs 85 40 ns csb setup time t css 90 30 ns csb hold time t csh 85 30 ns sck setup time t scks 90 30 ns sck hold time t sckh 90 30 ns si setup time t dis 20 10 ns si hold time t dih 30 10 ns data output delay time1 t pd1 60 40 ns data output delay time2 (c l2 =30pf) t pd2 50 30 ns output hold time t oh 0 0 ns output disable time t oz 100 40 ns holdb setting setup time t hfs 0 0 ns holdb setting hold time t hfh 40 30 ns holdb release setup time t hrs 0 0 ns holdb release hold time t hrh 70 30 ns time from holdb to output high-z t hoz 100 40 ns time from holdb to output change t hpd 60 40 ns sck rise time (note1) t rc 2 2 s sck fall time (note1) t fc 2 2 s output rise time (note1) t ro 40 20 ns output fall time (note1) t fo 40 20 ns write time t e/w 4 4 ms (note1) not 100% tested ac measurement conditions parameter symbol limit unit min typ max load capacitance1 c l1 100 pf load capacitance2 c l2 30 pf input rise time 50 ns input fall time 50 ns input voltage 0.2 vcc / 0.8 vcc v input / output judgment voltage 0.3 vcc / 0.7 vcc v figure 1. input / output judgment voltage 0.7vcc 0.2vcc 0.8vcc ?R 0.3vcc ?R input voltage input / output voltage downloaded from: http:///
br25h640-2ac 5/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 serial input / output timing si is taken into ic inside in sync with data rise edge of sc k. input address and data from the most significant bit msb. figure 2. input timing csb sck si so tpd toh tro , tfo toz tcsh tsckh tcs hi g h- z figure 3. input / output timing so is output in sync with data fall edge of sck. da ta is output from the most significant bit msb. csb sck si n+1 "h " "l" n dn n-1 dn dn-1 holdb so dn+1 thfs thfh tho z thrs thrh tdis thp d high-z figure 4. hold timing csb sck si so tcs tcss tscks tsckwl tsckwh tdis tdih trc tfc high-z downloaded from: http:///
br25h640-2ac 6/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 block diagram pin configuration pin description pin number pin name input / output function 1 csb input chip select input 2 so output serial data output 3 wpb input write protect input write status register command is prohibited. 4 gnd all input / output reference voltage, 0v 5 si input serial data input start bit, instruction code, address and data input 6 sck input serial clock input 7 holdb input hold input serial communications may be suspended temporarily (hold state). 8 vcc supply voltage so instruction decode control clock generation voltage detection write inhibition high voltage generator instruction register 64kbit eeprom address register data register address decoder read/write amp 8bit 8bit status register csb sck holdb 13bit 13bit wpb si identification page figure 5. block diagram vcc holdb sck si csb so wpb gnd br25h640-2ac figure 6. pin assignment diagram downloaded from: http:///
br25h640-2ac 7/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 typical performance curves figure 9. output low voltage v ol , i ol (vcc=2.5v) figure 10. output high voltage v oh , i oh (vcc=2.5v) figure 7. input high voltage v ih (csb, sck, si, holdb, wpb) figure 8. input low voltage v il (csb, sck, si, holdb, wpb) 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0123456 su ppl y vol tage : vcc v iut lw vltage : v il v spec 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0123456 supply voltage : vcc v input high voltage : v ih v spec 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -6 -5 -4 -3 -2 -1 0 output high current : i oh ma output high voltage : v oh v spec 0.0 0.2 0.4 0.6 0.8 1.0 0123456 output low current : i ol ma output low voltage : v ol v spec ta= ta= ta= -40c 25c 125c ta= ta= ta= -40c 25c 125c ta= ta= ta= -40c 25c 125c ta= ta= ta= -40c 25c 125c downloaded from: http:///
br25h640-2ac 8/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 typical performance curves - continued figure 11. input leakage current i li (csb, sck, si, holdb, wpb) figure 12. output leakage current i lo (so) figure 13. supply current (write) i cc1,2 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0123456 supply voltage : vcc v input leakage current: i li [a] spec 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0123456 su ppl y vol tage : vcc v output leakage current: i lo [a] spec figure 14. supply current (read) i cc3,4 0.0 0.5 1.0 1.5 2.0 2.5 0123456 su ppl y vol tage : vcc v supply current (read) : i cc3, 4 [ma] spec spec 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0123456 supply voltage : vcc v supply current (write) : i cc1, 2 [ma] spec spec ta= ta= ta= -40c 25c 125c ta= ta= ta= -40c 25c 125c ta= ta= ta= -40c 25c 125c ta= ta= ta= -40c 25c 125c downloaded from: http:///
br25h640-2ac 9/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 typical performance curves - continued figure 18. sck high time t sckwh figure 15. supply current (read) i cc5 figure 17. sck frequency f sck figure 16. standby current i sb 0 2 4 6 8 10 12 0123456 su ppl y vol tage : vcc v standby current : i sb [a] spec 0.1 1 10 100 0123456 supply voltage : vcc v sck frequency : f sck [mhz] spec spec 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0123456 supply voltage : vcc v supply current (read) : i cc5 [ma] spec 0 20 40 60 80 100 0123456 su ppl y vol tage : vcc v sck high time : t sckwh [ns] spec spec ta= ta= ta= -40c 25c 125c ta= ta= ta= -40c 25c 125c ta= ta= ta= -40c 25c 125c ta= ta= ta= -40c 25c 125c downloaded from: http:///
br25h640-2ac 10/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 typical performance curves - continued figure 21. csb setup time t css figure 19. sck low time t sckwl figure 20. csb high time t cs 0 20 40 60 80 100 0123456 su ppl y vol tage : vcc v csb setup time : t css [ns] spec spec figure 22. csb hold time t csh 0 20 40 60 80 100 0123456 su ppl y vol tage : vcc v csb hold time : t csh [ns] spec spec 0 20 40 60 80 100 0123456 su ppl y vol tage : vcc v sck low time : t sckw l [ns] spec spec 0 20 40 60 80 100 0123456 su ppl y vol tage : vcc v csb high time : t cs [ns] spec spec ta= ta= ta= -40c 25c 125c ta= ta= ta= -40c 25c 125c ta= ta= ta= -40c 25c 125c ta= ta= ta= -40c 25c 125c downloaded from: http:///
br25h640-2ac 11/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 typical performance curves - continued figure 23. si setup time t dis figure 24. si hold time t dih figure 25. data output delay time1 t pd1 (c l1 =100pf) 0 10 20 30 40 50 0123456 su ppl y vol tage : vcc v si setup time : t dis [ns] spec spec 0 10 20 30 40 50 0123456 supply voltage : vcc v si hold time : t dih [ns] spec spec 0 20 40 60 80 100 0123456 supply voltage : vcc v data output delay time1 : t pd1 [ns] spec spec figure 26. data output delay time2 t pd2 (c l2 =30pf) 0 20 40 60 80 100 0123456 su ppl y vol tage : vcc v data output delay time2 : t pd2 [ns] spec spec ta= ta= ta= -40c 25c 125c ta= ta= ta= -40c 25c 125c ta= ta= ta= -40c 25c 125c ta= ta= ta= -40c 25c 125c downloaded from: http:///
br25h640-2ac 12/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 typical performance curves - continued figure 30. time from holdb to output high-z t hoz 0 20 40 60 80 100 120 0123456 supply voltage : vcc v spec spec time from holdb to output high-z : t hoz [ns] figure 27. output disable time t oz figure 29. holdb release hold time t hrh figure 28. holdb setting hold time t hfh 0 20 40 60 80 100 0123456 su ppl y vol tage : vcc v holdb release hold time : t hrh [ns] spec spec 0 10 20 30 40 50 0123456 su ppl y vol tage : vcc v holdb setting hold time : t hfh [ns] spec spec 0 20 40 60 80 100 120 0123456 su ppl y vol tage : vcc v output disable time : t oz [ns] spec spec ta= ta= ta= -40c 25c 125c ta= ta= ta= -40c 25c 125c ta= ta= ta= -40c 25c 125c ta= ta= ta= -40c 25c 125c downloaded from: http:///
br25h640-2ac 13/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 typical performance curves - continued figure 33. output fall time t fo figure 32. output rise time t ro figure 31. time from holdb to output change t hpd 0 20 40 60 80 100 0123456 su ppl y vol tage : vcc v output fall time : t fo [ns] spec spec 0 20 40 60 80 100 0123456 su ppl y vol tage : vcc v output rise time : t ro [ns] spec spec 0 20 40 60 80 100 0123456 su ppl y vol tage : vcc v spec spec time from holdb to output change : t hpd [ns] figure 34. write time t e/w 0 2 4 6 8 0123456 su ppl y vol tage : vcc v write time : t e/w [ms] spec ta= ta= ta= -40c 25c 125c ta= ta= ta= -40c 25c 125c ta= ta= ta= -40c 25c 125c ta= ta= ta= -40c 25c 125c downloaded from: http:///
br25h640-2ac 14/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 1. features (1) status register this ic has the status registers. status register s are of 8 bits and express the following parameters. wpen, bp0 and bp1 can be set by write status register command. these 3 bits are memorized into the eeprom, therefore are valid even when supply voltage is turned off. write cycles and data retention of status registers are same as characteristics of the eeprom. wen can be set by write enable command and write disable command. wen becomes write disable status when supply voltage is turned off. r DD /b is for write confirmation, t herefore cannot be set externally. the values of status register can be read by read status register command. table 1. status register d7 d6 d5 d4 d3 d2 d1 d0 wpen 0 0 0 bp1 bp0 wen r DD /b table 2. function of status register bit memory location function content wpen eeprom pin enable / disable designation bit for wpb pin wpen=0=invalid, wpen=1=valid wpen bit enables / disables the function of wpb pin. bp1 bp0 eeprom eeprom write disable block designation bit bp1 and bp0 bits designate the write disable block of eeprom. refer table 3. write disable block setting. wen register write enable/write disable confirmation bit for write, wrsr, wrid and lid wen=0=prohibited, wen=1=permitted wen bit indicates the status of write enable or write disable for write, wrsr, wrid, lid. r DD /b register write cycle status(ready DDDDDDD /busy) confirmation bit r DD /b=0=ready , r DD /b=1=busy r DD /b bit indicates the status of ready or busy of the write cycle. table 3. write disable block setting status register protected block protected addresses bp1 bp0 0 0 none none 0 1 upper 1/4 1800h to 1fffh 1 0 upper 1/2 1000h to 1fffh 1 1 whole memory 0000h to 1fffh, id page downloaded from: http:///
br25h640-2ac 15/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 (2) write protect mode by wpb pin by setting wpb = low with wpen = 1, write status regist er command is disabled. only when wpen bit is set 1, the wpb pin functions become valid. however, when write cycle is in execution, no interruption can be made. table 4. write protect mode wpen bit wpb pin instruction wrsr write/wrid/lid 0 x writable writable 1 1 writable writable 1 0 write protected writable wpb is normally fixed to high or low for use, but when wpb is controlled so as to cancel write status register command, pay attention to th e following wpb valid timing. write status register command is executed, by setting w pb = low in cancel valid area, command can be cancelled. the data area (from 7th fall of sck to 16th rise of sck) becom es the cancel valid area. however, once write is started, any input cannot be cancelled. wpb input becomes dont care, and cancellation becomes invalid. (3) hold mode by holdb pin by the holdb pin, serial communication can be stopped tem porarily (hold status). holdb pin carries out serial communications normally when it is high. to get in hold status, at serial communication, when sck = low, set the holdb pin low. at hold status, sck and si become don t care, and so becomes high impedance (high-z). to release the hold status, set the holdb pin high when sc k = low. after that, communication can be restarted from the point before the hold status. for example, when hold status is made af ter a5 address input at read command, after release of hold status, by starting a4 address in put, read command can be restarted. when in hold status, leave csb = low. when it is set csb = high in hold stat us, the ic is reset, therefore communication after that cannot be restarted. figure 35. wpb valid timing (wrsr) 6 7 instruction code data te/w data write time sck 15 16 invalid csb invalid valid instruction write protect figure 36. hold status sck holdb hold status hold status downloaded from: http:///
br25h640-2ac 16/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 (4) id page this ic has 32 bytes write lockable identification page (id page) in addition to memory array. the data in the first 3 addresses are for device identification. these data are over written by write id page command. table 5. data in the first 3 addresses id page address data content 00h 2fh manufacturer code (rohm) 01h 00h interface method (spi) 02h 0dh memory density (64kbit) by setting lock status (ls) bit to 1 with lock id page command, it is prohibited to write to id page permanently. it is not reversible to set from id page lock status (ls=1) to id page lock release status (ls=0). table 6. function of lock status bit memory location function content ls eeprom id page lock/ lock release status designation bit ls=0=id page lock release ls=1=id page lock ls bit can set lock status to id page. (5) ecc function this ic has ecc bits for error correction to each 4 data by tes with the same address bits of a12 to a2. in the read operation, even if there is 1 bit data error in the 4 bytes, ic corrects to correct data by ecc function and outputs data corrected. even if write operation is started with only 1 byte data input, this ic rewrites the data of 4 bytes with the same address bits of a12 to a2 and the data of ecc bits added to these 4 bytes data. in order to maximize write cycles specified, it is recommended to write with data input of each 4 bytes with the same address bits of a12 to a2. table 7. example of 4 data bytes with the same addr ess bits of a12 to a2 (address 0000h,0001h,0002h,0003h) same address bits from a12 to a2 non- common address a12 a11 a10 a9 a8 a7 a6 a5 a4 a3 a2 a1 a0 0 0 0 0 0 0 0 0 0 0 0 0 0 0000h 0 0 0 0 0 0 0 0 0 0 0 0 1 0001h 0 0 0 0 0 0 0 0 0 0 0 1 0 0002h 0 0 0 0 0 0 0 0 0 0 0 1 1 0003h downloaded from: http:///
br25h640-2ac 17/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 2. instruction mode after setting csb pin from high to low, to execute each command, input instruction code, address and data from the most significant bit msb. table 8. instruction mode instruction content instruction code (8bit) address(msb) / data (8bit) address (lsb) (8bit) data (8bit) wren write enable 0000 0110 - - - wrdi write disable 0000 0100 - - - read read 0000 0011 a15 to a8 (note1) a7 to a0 d7 to d0 output write write 0000 0010 a15 to a8 (note1) a7 to a0 d7 to d0 input rdsr read status register 0000 0101 d7 to d0 output (note2) - - wrsr write status register 0000 0001 d7 to d0 input (note2) - - rdid read id page 1000 0011 0000 0000 00a4 to a0 d7 to d0 output wrid write id page 1000 0010 0000 0000 00a4 to a0 d7 to d0 input rdls read lock status 1000 0011 0000 0100 0000 0000 d7 to d0 output (note3) lid lock id page 1000 0010 0000 0100 0000 0000 d7 to d0 input (note3) (note1) address bit a15, a14, a13 = dont care (note2) refer figure 43. , figure 44.. (note3) refer figure 47. , figure 48.. downloaded from: http:///
br25h640-2ac 18/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 3. timing chart (1) write enable command (wren) it is set to write enable status by write enable command. as for this command, set csb to low, and then input the instruction code of write enable command. this command is accepted at the 7th rise of sck. even with input over 7 clocks, command becomes valid. before carrying out write command, write status regi ster command, write id page command and lock id page command, it is necessary to set write enable status by the write enable command. (2) write disable command (wrdi) it is set to write disable status, wen bi t becomes to 0, by write disable co mmand. as for this command, set csb to low, and then input the instruction code of write disable command. this command is accepted at the 7th rise of sck. even with input over 7 clocks, command becomes valid. if write command, write status register command, write id page command or lock id page command is input in the write disable status, commands are cancelled. and even in the write enable status, once write command, write status register command, write id page command or lock id page is executed, it gets in the write disable status. after power on, this ic is in write disable status. figure 37. write enable command figure 38. write disable command high-z 6 0 3 7 1 2 4 5 csb sck so si 0 0 0 0 0110 high-z 00 0 0 si 0 10 0 0 3 12 4 7 csb sck 5 6 so downloaded from: http:///
br25h640-2ac 19/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 (3) read command (read) by read command, data of eeprom can be read. as for th is command, set csb to low, then input address after instruction code of read command. this ic starts data output of the designated address. data output is started from sck fall of 23 clock, and from d7 to d0 sequentially. this ic has increment read function. after output of data for 1 byte (8bits), by continuing input of sck, data of t he next address can be read. increment read can read all the addresses of eeprom array. after reading data of the most significant address, by continuing increment read, data of the least significant address is read. (4) write command (write) by write command, data of eeprom can be written. as fo r this command, set csb to low, then input address and data after instruction code of write command. then, by maki ng csb to high, the ic starts write operation. the write time of eeprom requires time of t e/w (max 4ms). to start write operation, set csb low to high after taking the last data (d0), and before the next sck clock starts. at other timing, write command is not executed, and this write command is cancelled. during write operation, other than read st atus register command is not accepted. this ic has page write function, and after input of data for 1 byte (8bits), by continuing data input without setting csb low to high, data up to 32 bytes can be written for one t e/w . in page write, the addressed lower 5 address bits are incremented internally at every time when data of 1 byte is inputted and data is written to respective addresses. when the data input exceeds the last address byte of the page, addre ss rolls over to the first address byte of the same page. it is not recommended to input data over 32 bytes, it is re commended to input data in 32 bytes. in case of the data input over 32 bytes, it is explained in table 10. figure 41. write command (page write) high-z 11 1 1 0 0 3 7 1 2 d 6 s o csb sck si 4 5 a 12 6 8 x x a 0 a 1 d7 23 30 24 d0 0 0 0 0 0 d 2 d1 x 10 9 d7 instruction code(8bit) ad dr ess in put ( 16 bit) 31 da ta o u tp uts of fi rst b yte (8 bit) second byte figure 39. read command figure 40. write command (byte write) x =dont care high-z x=don't care 3 1 d0 0 0 0 0 0 d2 d1 d7 23 30 24 d6 0 a0 a1 x 1 1 2 4 0 csb sck si so 0 3 7 8 5 6 a12 x 11 x 10 9 32 csb rising valid timing to start write operation instructi on co de (8b it) address input (16bit) data input (8bit) high-z (8n+24) - 1 3 2 d7 0 0 0 0 0 d1 d0 d7 23 31 24 d6 0 a0 a1 x 1 1 2 4 0 csb sck si s o 0 3 7 8 5 6 11 25 30 3 3 8n+24 d6 d7 d6 d 0 c sb ri sing valid timing to start write operation (8n+24 ) -2 (8n+24 ) - 7 (8n+24 ) -8 x=dont care x 10 a1 2 x 9 instruction code (8bit) data input of first byte (8bit) data input of nth byte address input (16bit) downloaded from: http:///
br25h640-2ac 20/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 (a) page write function column 0 column 1 column 2 ??? column 30 column 31 page 0 0000h 0001h 0002h ??? 001eh 001fh page 1 0020h 0021h 0022h ??? 003eh 003fh page 2 0040h 0041h 0042h ??? 005eh 005fh ? ? ? ? ? ? ? ? ? ? ? ? ? ? page 254 1fc0h 1fc1h 1fc2h ??? 1fdeh 1fdfh page 255 1fe0h 1fe1h 1fe2h ??? 1ffeh 1fffh in case of page write command with lower than 32 bytes data input table 9. example of page write with 2 bytes data input no. 4 bytes group group 0 ??? ??? group 7 addresses of page 0 0000h 0001h 0002h 0003h 0004h ??? 001ch 001dh 001eh 001fh previous data 00h 01h 02h 03h 04h ??? 1ch 1dh 1eh 1fh input data for page write (2 bytes) aah 55h - - - ??? - - - - the data after write operation aah 55h 02h 03h 04h ??? 1ch 1dh 1eh 1fh no. these data are eeprom data before write operation. no. inputted 2 bytes data aah, 55h from address 0000h. no. if write operation is execut ed with the data of no. , the data are changed from the data of no. to the data of no. . the data of address 0000h, 0001h are changed to data aa h, 55h, the data of addr ess 0002h, 0003h, the 4 bytes group of group 0, are over-written to data 02h, 03h. when write command is cancelled, eeprom data keep no. . in case of page write command with more than 32 bytes data input table 10. example of page write with 34 bytes data input no. 4 bytes group group 0 ??? ??? group 7 addresses of page 0 0000h 0001h 0002h 0003h 0004h ??? 001ch 001dh 001eh 001fh previous data 00h 01h 02h 03h 04h ??? 1ch 1dh 1eh 1fh input data for page write (34 bytes) 55h aah 55h aah 55h ??? 55h aah 55h aah ffh 00h - - - ??? - - - - the data after write operation ffh 00h 02h 03h 55h ??? 55h aah 55h aah no. these data are eeprom data before write operation. no. inputted 34 bytes data 55h, aah, ???? , 55h, aah, ffh, 00h from address 0000h. the data of address 0000h, 0001h are set to data 55h, aah first. the data of address 0002h, 0003h are set to data 55h, aah. after inputting data to maximum byte (001fh), the data address 0000h, 0001h are set to data ffh, 00h again. no data input to address 0002h, 0003h again. no. if write operation is execut ed with the data of no. , the data are changed from the data of no. to the data of no. . the data of address 0000h, 0001h are changed to ffh, 00h inputted data later, not to 55h, aah inputted data first. the data of address 0002h, 0003h, the 4 byte s group of group 0, are over-written to 02h, 03h of previous data, not to 55h, aah inputted data firs t. the data of other addresses are changed to 55h, aah ???? , 55h, aah. when write command is cancelled, eeprom data keep no. . roll over in page write command, when data is set to the last addr ess of a page (e.g. address 001fh of page 0), the next data will be set to the first address of the same page (e.g. address 0000h of page 0). this is why page write address increment is available in the same page. figure 42. eeprom physical address for page write command (32byte) these column addresses are the last address of each pages. 32 bytes of page these column addresses are the first address of each pages. downloaded from: http:///
br25h640-2ac 21/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 (5) read status register command (rdsr) by read status register command, data of status register can be read. as fo r this command, set csb to low, then input instruction code of read status register command. this ic starts data output of the status register. data output is started from sck fall of 7 clock, and from d7 to d0 sequentially. this ic has increment read function. after output of data for 1 byte (8bits), by continuing input of sck, this ic repeats to output data of the status register. even if in write operation, read stat us register command can be executed. (6) write status register command (wrsr) write status register command can writ e status register data. the data can be written by this command are 3 bits, that is, wpen (d7), bp1 (d3) and bp0 (d2) among 8 bits of status register. as for this command, set csb to low, and input instruction code of write status register comma nd, and input data. then, by making csb to high, this ic starts write operation. write time requires time of t e/w as same as write command. as for csb rise, start csb after taking the last data bit (d0), and before the next sck cl ock starts. at other timing, command is cancelled. to the write disabled block, write cannot be made, and only read can be made. during write operation, other than read st atus register command is not accepted. csb sck high-z x=don't care 0 0 0 0 1 wp e n 0 1 2 4 0 si so 0 3 7 8 5 6 x 9 1 0 11 1 2 13 1 4 1 5 x bp 1 bp 0 d7 d6 d5 d4 d3 d2 d1 d0 0 data outp u t (8bit) inst ruct ion code (8 bit) xx x figure 43. read status register command d7 d6 d5 d4 0 0 bp 0 0 bp1 d3 d2 d1 d0 13 csb sc k si 1 1 10 6 0 s o 14 1 2 wen r/b 11 15 3 7 9 0 5 12 0 0 0 0 0 4 8 wpen data output (8bit) instruction code (8bit) high-z figure 44. write status register command downloaded from: http:///
br25h640-2ac 22/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 (7) read id page command (rdid) by read id page command, data of id page can be read. as for this command, set csb to low, then input address after instruction code of read id page command. input addre ss bit a10 as 0, other upper address bits a12 to a6 as 0. by inputting lower address bits a4 to a0, it is possible to address to 32 bytes id page. data output is started from sck fall of 23 clock, and from d7 to d0 sequentially. this ic has increment read function. after output of data for 1 byte (8bits), by continuing input of sck, data of t he next address can be read. afte r reading data of the most significant address of id page, by continuing increment read , data of the least significant address of id page is read. (8) write id page command (wrid) by write id page command, data of id page can be written. as for this command, set csb to low, then input address and data after instruction code of write id page command. input address bit a10 as 0, other upper address bits a12 to a6 as 0. by inputting lower address bits a4 to a0, it is possible to address to 32 bytes id page. then, by making csb to high, the ic starts write operation. to start write operation, set csb low to high after taking the last data (d0), and before the next sck clock starts. at other timing, write id page command is not executed, and this write id page command is cancelled. the write time of eeprom requires time of t e/w (max 4ms). during write operation, other than read st atus register command is not accepted. in case of lock status (ls) bit 1, write id page command cant be executed. write id page command has page write function same as write command. figure 45. read id page command figure 46. write id page command high-z 11 1 1 0 0 3 7 1 2 d6 so csb sck si 4 5 a 12 6 8 0 0 a 0 a 1 d7 23 30 24 d0 1 0 0 0 0 d2 d1 0 10 9 d7 instructi on code(8bit) address input (16bit) 31 data outputs of first byte (8bit) second byte high-z 31 d0 0 0 0 0 d2 d1 d7 23 30 2 4 d6 0 a 0 a 1 0 1 1 2 4 0 csb sck si so 0 3 7 8 5 6 a12 0 11 10 9 32 csb rising valid timing to start write operation instruction code (8bit) a ddr ess inp ut (16 bit) data input (8bit) 1 0 downloaded from: http:///
br25h640-2ac 23/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 (9) read lock status command (rdls) by read lock status command, data of lo ck status can be read. as for this command, set csb to low, then input address after instruction code of read lock status command. i nput address bit a10 as 1, other address bits a12 to a0 as 0. data output is started from sck fall of 23 clock, and from d7 to d0 sequentially. the data d0 indicates lock status bit. the data d7 to d1 are dont care. this ic has increment read function. after output of data for 1 byte (8bits), by continuing input of sck, this ic repeats to output data of the lock status byte. in case of lock status (ls) bit 1, id page is locked, write id page command cant be exec uted. in case of ls bit 0, id page is released to lock, write id page command can be executed. (10) lock id page command (lid) by lock id page command, data of lock status can be writt en. in case of lock status (ls) bit 1, lock id page command cant be executed permanently. as for this comma nd, set csb to low, then input address and data after instruction code of lock id page command. input address bit a 10 as 1, other address bits a12 to a0 as 0. the data d1 is for ls bit, other data bits are dont care. then, by making csb to high, the ic starts write operation. to start write operation, set csb low to high after taking t he last data (d0), and before the next sck clock starts. at other timing, lock id page command is not executed, and this lock id page command is cancelled. the write time of eeprom requires time of t e/w (max 4ms). during write operation, other than read st atus register command is not accepted. at standby state 1. standby current set csb = high, and be sure to set sck, si, wpb and holdb inputs = low or high. do not input intermediate electric potential. 2. timing as shown in figure.49, at standby, when sck is high, even if csb is fallen, si status is not r ead at fall edge. si status is read at sck rise edge after fall of csb. at st andby and at power on/off, set csb = high status. figure 47. read lock status command figure 48. lock id page command figure 49. operating timing 0 1 2 command start here. si is read. even if csb is fallen at sck=si=h, si status is not read at that edge. csb sck si high-z 11 1 1 0 0 3 7 1 2 d6 so csb sck si 4 5 a 12 6 8 0 0 a 0 a 1 d7 23 30 24 d0 1 0 0 0 0 d 2 d1 10 9 instructi on code(8bit) address input (16bit) 31 data outputs of first byte (8bit) second byte x x x x x ls x =d on t ca re 0 high-z 31 d0 0 0 0 0 d 2 d1 d7 23 30 2 4 d6 0 a 0 a 1 0 1 1 2 4 0 csb sck si so 0 3 7 8 5 6 a 12 0 11 10 9 32 csb rising valid timing to start write operation instruction code (8bit) a ddr ess inp ut (16 bit) data input (8bit) 1 x x x x ls x x=dont care 0 downloaded from: http:///
br25h640-2ac 24/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 method to cancel each command 1. read, rdid, rdls ? method to cancel : cancel by csb = high 2. rdsr ? method to cancel : cancel by csb = high 3. write, wrid, lid a instruction code, address input area cancellation is available by csb = high. b data input area (d7 to d1 input area) cancellation is available by csb = high. c data input area (d0 area) when csb is started, write starts. after csb rise, cancellation cannot be made by any means. d t e/w area cancellation is available by csb = high. however, when write starts (csb is started) in the area c, cancellation cannot be made by any means. and by inputting on sck clock, cancellation cannot be made. in page write mode, there is writ e enable area at every 8 clocks note 1) if v cc is made off during write execution, des ignated address data is not guaranteed, therefore write it once again. note 2) if csb is started at the same timing as that of the sck rise, write execution / cancel becomes unstable, therefore, it is recommended to fall in sck = lo w area. as for sck rise, assure timing of t css / t csh or higher. 4. wrsr a from instruction code to 15th rising of sck cancel by csb = high. b from 15th rising of sck to 16th rising of sck (write enable area) when csb is started, write starts. c after 16th rising of sck cancel by csb = high. however, when write starts (csb is started) in the area b, cancellation cannot be made by any means. and, by inputting on sck clock, cancellation cannot be made. note 1) if v cc is made off during write execution, des ignated address data is not guaranteed, therefore write it once again. note 2) if csb is started at the same timing as that of the sck rise, write execution / cancel becomes unstable, therefore, it is recommended to fall in sck = lo w area. as for sck rise, assure timing of t css / t csh or higher. 5. wren/wrdi a from instruction code to 7th rising of sck cancel by csb = high. b cancellation is not available when csb is started after 7th clock. instruction code address cancel available in all areas of read modes data 8bits 16bits 8bits figure 50. read, rdid, rdls cancel valid timing instruction code cancel available in all areas of rdsr data 8 bits 8 bits figure 51. rdsr cancel valid timing instruction code address a data t e/ w b d c 8 bits 16 bits 8 bits figure 54. wren/wrdi cancel valid timing d7 b d6 d5 d4 d3 d2 d1 d0 sck si c figure 52. write, wrid, lid cancel valid timing instruction code data t e/w 8 bits 14 15 16 17 d1 d0 a b c 8 bits a b c sck si instruction code 8 bits 6 7 8 a b sck figure 53. wrsr cancel valid timing downloaded from: http:///
br25h640-2ac 25/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 high speed operation in order to realize stable high speed operations, pay a ttention to the following input / output pin conditions. 1. pull up, pull down resistance for input pins when to attach pull up, pull down resistance to eeprom input pins, select an appropriate value for the microcontroller v ol , i ol from v il characteristics of this ic. 2. pull up resistance and, in order to prevent malfunction, mistake writ e at power on/off, be sure to make csb pull up. 3. pull down resistance further, by amplitude v ihe , v ile of signal input to eeprom, operation speed changes . by inputting signal of amplitude of vcc / gnd level to input, more stable high speed operations can be realized. on the contrary, w hen amplitude of 0.8vcc / 0.2vcc is input, operation speed becomes slow. (note1) in order to realize more stable high speed operat ion, it is recommended to make the values of r pu , r pd as large as possible, and make the amplitude of signal input to eeprom close to the amplitude of vcc / gnd level. (note1) at this moment, operating timing guaranteed value is guaranteed. figure 57. v il dependency of data output delay time t pd 4. so load capacitance condition load capacitance of so pin affects upon delay characteristic of so output. (data output delay time, time from holdb to high-z) in order to make output delay characteristic into higher speed, make so load capacitance small. in concrete, do not connect many devices to so bus, make the wire be tween the controller and eeprom short, and so forth. 5. other cautions make the wire length from the microcontroller to eeprom input signal same lengt h, in order to prevent setup / hold violation to eeprom, owing to difference of wire length of each input. i olm v ile v olm low output low input microcontroller eeprom r pu figure 55. pull up resistance with the value of r pu to satisfy the above equation, v olm becomes 0.4v or lower, and with v ile (=1.5v), the equation is also satisfied. ? v ile : v il specifications of eeprom ? v olm : v ol specifications of microcontroller ? i olm : i ol specifications of microcontroller i ohm v ihe v ohm microcontroller eeprom high output high input r pd figure 56. pull down resistance example) when v cc =5v, v ohm =v cc -0.5v, i ohm 0.4ma, v ihe =v cc 0.7v, from the equation , example) when vcc=5v, v ile =1.5v, v olm =0.4v, i olm =2ma, from the equation , ??? ??? ??? ??? ? v ihe : v ih specifications of eeprom ? v ohm : v oh specifications of microcontroller ? i ohm : i oh specifications of microcontroller ol m ol m c c p u i v v r - ? il e olm v v ? -3 - 10 2 40 5 ? ? . r p u k . r p u 32 ? oh m oh m p d i v r ? ih e ohm v v ? -3 - 10 40 50 5 ? ? . . r p d k . r pu 3 11 ? ? t pd - v il characteristic 0 10 20 30 40 50 60 70 80 0 0.2 0.4 0.6 0.8 1 v il [v] t pd [ns] vcc=2.5v ta=25 c vih=vcc c l =100pf spec downloaded from: http:///
br25h640-2ac 26/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 i/o equivalence circuit 1. output circuit 2. input circuit oeint. so figure 58. so output equivalent circuit csb reset int. figure 59. csb input equivalent circuit sck si holdb wpb figure 60. sck input equivalent circuit figure 61. si input equivalent circuit figure 62. holdb input equivalent circuit figure 63. wpb input equivalent circuit downloaded from: http:///
br25h640-2ac 27/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 power-up/down conditions 1. at power on/off, set csb = high (=vcc). when csb is low, this ic gets in input accept status (active). if power is turned on in this status, noises and the likes may cause malfunction, mistake write or so. to prevent these, at power on, set csb = high. (when csb is in high status, all inputs are canceled.) (good example) csb pin is pulled up to vcc. at power off, take 10ms or higher before supply. if power is turned on without observing this condition, the ic internal circuit may not be reset, which please note. (bad example) csb pin is low at power on/off. in this case, csb always becomes low (active status), and eeprom may have malfunction, mistake write owing to noises and the likes. even when csb input is high-z, the status becomes like this case, which please note. 2. por circuit this ic has a por (power on reset) circuit as mistake writ e countermeasure. after por , it gets in write disable status. the por circuit is valid only when power is on, and does not work when power is off. when power is on, if the recommended conditions of the following tr, toff, and vbot are not satisfied, it may become write enable status owing to noises and the likes. table 11. recommended conditions of tr, toff, vbot 3. lvcc circuit lvcc (vcc-lockout) circuit prevents data rewrite operati on at low supply voltage, and prevents wrong write. at lvcc voltage (typ. =1.9v) or below, it prevent data rewrite. noise countermeasures 1. vcc noise (bypass capacitor) when noise or surge gets in the power source line, malfunction may occur, therefore, for removing these, it is recommended to attach a bypass capacitor (over 0.1 f) between ic vcc and gnd. at that moment, attach it as close to ic as possible. and, it is also recommended to attach a bypass capacitor between board vcc and gnd. 2. sck noise when the rise time (t rc ) of sck is long, and a certain degree or more of noise exists, malfunction may occur owing to clock bit displacement. to avoid this, a schmitt trigger circuit is built in sck input. the hysteresis width of this circuit is set about 0.2v, if noises exist at sck input, set the noise amplit ude 0.2vp-p or below. and it is recommended to set the rise time (t rc ) of sck 100ns or below. in the case when the rise time is 100ns or higher, take sufficient noise countermeasures. make the clock rise, fall time as small as possible. 3. wpb noise during execution of write status regist er command, if there exist noises on wpb pin, mistake in recognition may occur and forcible cancellation may result, which please note. to avoid this, a schmitt trigger circuit is built in wpb input. in the same manner, a schmitt trigger circuit is buil t in csb input, si input and holdb input too. tr toff vbot 10ms or below 10ms or higher 0.3v or below 100ms or below 10ms or higher 0.2v or below tr toff vbot 0 vcc figure 65. rise waveform figure 64. csb timing at power on / off bad example good exam p le gnd csb vcc gnd vcc vcc downloaded from: http:///
br25h640-2ac 28/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance s upply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bl ock from affecting the analog block. furthermore, connect a capacitor to ground at all po wer supply pins. consider t he effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the refer ence point of the application board to av oid fluctuations in the small-signal ground caused by large currents. also ensure that the grou nd traces of external components do not cause variations on the ground voltage. the ground lines must be as s hort and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possi ble that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comp letely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as meta l particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. downloaded from: http:///
br25h640-2ac 29/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 operational notes C continued 11. unused input pins input pins of an ic are often connected to the gate of a mos transis tor. the gate has extremely high impedance and extremely low capacitance. if left unconnec ted, the electric field from the outsi de can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction thr ough the transistor and cause unexpected operation of the ic. so unless otherwise specif ied, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevitably formed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutual interfer ence among circuits, operational faults, or physical damage. therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. furthermore , do not apply a voltage to the input pins when no power supply voltage is applied to the ic. even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in t he electrical characteristics of this ic. downloaded from: http:///
br25h640-2ac 30/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 part numbering b r 2 5 h 6 4 0 x x x - 2 a c x x lineup capacity package orderable part number type quantity 64kbit msop8 reel of 3000 br25h640fvm -2actr tssop-b8 reel of 3000 br25h640fvt -2ace2 sop8 reel of 2500 br25h640f -2ace2 sop-j8 reel of 2500 br25h640fj -2ace2 bus type 25 : spi operating temperature / voltage h : -40 o c to +125 o c / 2.5v to 5.5v 2 : process code a : revision c : for automotive application packaging and formi ng specification e2 : embossed tape and reel tr : embossed tape and reel (msop8 package only) capacity 640 : 64kbit package fvm : msop8, fvt : tssop-b8, f : sop8, fj : sop-j8 downloaded from: http:///
br25h640-2ac 31/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 physical dimension, tape and reel information package name msop8 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin downloaded from: http:///
br25h640-2ac 32/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 physical dimensions, tape and reel information - continued package name tssop-b8 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () 1pin downloaded from: http:///
br25h640-2ac 33/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 physical dimensions, tape and reel information - continued package name sop8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (max 5.35 (include.burr) downloaded from: http:///
br25h640-2ac 34/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 physical dimensions, tape and reel information - continued package name sop-j8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin downloaded from: http:///
br25h640-2ac 35/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 marking diagrams (top view) msop8 (top view) h 6 4 part number marking lot number 1pin mark a tssop-b8 (top view) h640a part number marking lot numbe r 1pin mark sop8 (top view) h640a part number marking lot numbe r 1pin mark sop-j8 (top view) h640a part number marking lot number 1pin mark downloaded from: http:///
br25h640-2ac 36/36 datasheet d a t a s h e e t www.rohm.com ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0r1r0g100210-1-2 16.feb.2016 rev.002 revision history date revision changes 01.oct.2014 001 new release 16.feb.2016 002 p4 indicated limit of t fo . p19 modified sentence in (4) write command. p20 modified figure 42.. downloaded from: http:///
notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extreme ly high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in advance. unless otherwise agreed in writin g by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific applic ations japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adeq uate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or c onditions (as exemplified below), your independent verification and confirmation of product performance, reliabil ity, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7. de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts, please consult with th e rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contain ed in this document are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take p roper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert its intellectual property rights or other rights a gainst you or your customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in p art, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified , reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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